PART |
Description |
Maker |
R-8 |
8-Lead Standard Small Outline Package [SOIC_N] Narrow Body Dimensions
|
Analog Devices
|
SOT108-1 |
SO14: plastic small outline package; 14 leads; body width 3.9 mm
|
NXP Semiconductors Philips Semiconductors
|
MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸(16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu... ICSI[Integrated Circuit Solution Inc] Intersil, Corp.
|
081029133013 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
DFN1006H4-2 AP02002 DFN0603H3-2 DFN1006-2 DFN1006- |
PACKAGE OUTLINE DIMENSIONS
|
Diodes Incorporated
|
506AL |
MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS
|
ONSEMI[ON Semiconductor]
|
2240-0 |
Connectors, Accessories; For Use With:Banana plug patch cords; Accessory Type:Alligator clip; Body Length:2.3"; Body Material:Steel; Color:Black; Size/Dimensions:.300; Voltage Rating:150V INTERCONNECTION DEVICE
|
Pomona Electronics
|
AP2301EN-HF-14 |
Small Package Outline
|
Advanced Power Electron...
|
FDG6322C |
Very small package outline SC70-6.
|
TY Semiconductor Co., L...
|
SO-8 |
8-LEAD SMALL OUTLINE PACKAGE
|
STMicroelectronics
|
CSSOP |
Ceramic Shrink Small Outline Package
|
Amkor Technology
|